EPSILON-TI2N PHASE GROWTH-CONTROL IN TITANIUM NITRIDE FILMS

被引：36

作者：

POULEK, V ^{[1
]}

MUSIL, J ^{[1
]}

CERNY, R ^{[1
]}

KUZEL, R ^{[1
]}

机构：

[1] CHARLES UNIV, FAC MATH & PHYS, DEPT SEMICONDUCTOR PHYS, CS-12116 PRAGUE 2, CZECHOSLOVAKIA

来源：

关键词：

D O I：

10.1016/0040-6090(89)90738-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：L55 / L58

页数：4

共 6 条

[1] ASPLUND M, 1985, 1985 MAT RES SOC FAL
[2] DEPOSITION OF TI-N COMPOUNDS BY THERMIONICALLY ASSISTED TRIODE REACTIVE ION PLATING
MATTHEWS, A
TEER, DG
[J]. THIN SOLID FILMS, 1980, 72 (03) : 541 - 549
[3] TURNING PERFORMANCE OF REACTIVELY ION PLATED TI-N COATINGS
MOLARIUS, JM
KORHONEN, AS
KANKAANPAA, H
SULONEN, MS
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1986, 4 (06): : 2686 - 2690
[4] TI-N PHASES FORMED BY REACTIVE ION PLATING
MOLARIUS, JM
KORHONEN, AS
RISTOLAINEN, EO
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (06): : 2419 - 2425
[5] INFLUENCE OF DEPOSITION RATE ON PROPERTIES OF REACTIVELY SPUTTERED TIN-CHI FILMS
MUSIL, J
POULEK, V
VYSKOCIL, J
KADLEC, S
VALVODA, V
KUZEL, R
CERNY, R
[J]. VACUUM, 1988, 38 (06) : 459 - 461
[6] POULEK V, 1988, 05888 I PHYS PRAG RE