NUMERICAL INVESTIGATIONS OF THE ELECTROMIGRATION BOUNDARY-VALUE PROBLEM

被引:44
作者
CLEMENT, JJ [1 ]
LLOYD, JR [1 ]
机构
[1] MAX PLANCK INST MET RES,INST WERKSTOFFWISSENSCH,W-7000 STUTTGART 80,GERMANY
关键词
D O I
10.1063/1.351204
中图分类号
O59 [应用物理学];
学科分类号
摘要
The electromigration diffusion boundary value problem with the perfectly blocking diffusion barrier is numerically investigated. Three possible boundary conditions are identified as physically meaningful and the solutions compared at the blocking barrier. It is seen that the solution of M. Shatzkes and J. R. Lloyd [J. Appl. Phys. 59, 3890 (1986)] is a good approximation for the time to failure if the critical vacancy concentration for failure is not too near a steady-state value. A dimensionless parameter is introduced which may be useful in estimating ultimate electromigration performance.
引用
收藏
页码:1729 / 1731
页数:3
相关论文
共 11 条
[1]  
BLACK JR, 1967, 6TH P ANN REL PHYS S, V148
[2]   STRESS GENERATION BY ELECTROMIGRATION [J].
BLECH, IA ;
HERRING, C .
APPLIED PHYSICS LETTERS, 1976, 29 (03) :131-133
[3]   ELECTROMIGRATION IN THIN ALUMINUM FILMS ON TITANIUM NITRIDE [J].
BLECH, IA .
JOURNAL OF APPLIED PHYSICS, 1976, 47 (04) :1203-1208
[4]   The phenomenological theory of the Soret effect [J].
De Groot, SR .
PHYSICA, 1942, 9 :699-708
[5]   ATOMISTIC AND COMPUTER MODELING OF METALLIZATION FAILURE OF INTEGRATED-CIRCUITS BY ELECTROMIGRATION [J].
KIRCHHEIM, R ;
KAEBER, U .
JOURNAL OF APPLIED PHYSICS, 1991, 70 (01) :172-181
[6]   THE EFFECT OF PASSIVATION THICKNESS ON THE ELECTROMIGRATION LIFETIME OF AL/CU THIN-FILM CONDUCTORS [J].
LLOYD, JR ;
SMITH, PM .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1983, 1 (02) :455-458
[7]   THE ELECTROMIGRATION FAILURE DISTRIBUTION - THE FINE-LINE CASE [J].
LLOYD, JR ;
KITCHIN, J .
JOURNAL OF APPLIED PHYSICS, 1991, 69 (04) :2117-2127
[8]  
LLOYD JR, UNPUB
[9]  
NIKAWA K, 1981, 20TH P ANN REL PHYS, V175
[10]   SIMULATION OF CRITICAL IC-FABRICATION STEPS [J].
PICHLER, P ;
JUNGLING, W ;
SELBERHERR, S ;
GUERRERO, E ;
POTZL, HW .
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 1985, 4 (04) :384-397