THE EFFECT OF PASSIVATION THICKNESS ON THE ELECTROMIGRATION LIFETIME OF AL/CU THIN-FILM CONDUCTORS

被引：64

作者：

LLOYD, JR

SMITH, PM

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1983年 / 1卷 / 02期

关键词：

D O I：

10.1116/1.571946

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

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页码：455 / 458

页数：4

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共 15 条

[1] COATING, MECHANICAL CONSTRAINTS, AND PRESSURE EFFECTS ON ELECTROMIGRATION
AINSLIE, NG
WELLS, OC
DHEURLE, FM
[J]. APPLIED PHYSICS LETTERS, 1972, 20 (04) : 173 - &
[2] ELECTROMIGRATION - A BRIEF SURVEY AND SOME RECENT RESULTS
BLACK, JR
[J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1969, ED16 (04) : 338 - &
[3] ELECTROMIGRATION-INDUCED FAILURES IN ALUMINUM FILM CONDUCTORS
BLAIR, JC
GHATE, PB
HAYWOOD, CT
[J]. APPLIED PHYSICS LETTERS, 1970, 17 (07) : 281 - &
[4] MEASUREMENT OF STRESS GRADIENTS GENERATED BY ELECTROMIGRATION
BLECH, IA
TAI, KL
[J]. APPLIED PHYSICS LETTERS, 1977, 30 (08) : 387 - 389
[5] STRESS GENERATION BY ELECTROMIGRATION
BLECH, IA
HERRING, C
[J]. APPLIED PHYSICS LETTERS, 1976, 29 (03) : 131 - 133
[6] ELECTROMIGRATION IN THIN ALUMINUM FILMS ON TITANIUM NITRIDE
BLECH, IA
[J]. JOURNAL OF APPLIED PHYSICS, 1976, 47 (04) : 1203 - 1208
[7] ELECTROMIGRATION IN THIN SILVER, COPPER, GOLD, INDIUM, TIN, LEAD AND MAGNESIUM FILMS
BREITLING, HM
HUMMEL, RE
[J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1972, 33 (04) : 845 - +
[8] HEMMERT RS, 1982, J APPL PHYS, V53, P4456, DOI 10.1063/1.331231
[9] THRESHOLD CURRENT-DENSITY AND INCUBATION-TIME TO ELECTROMIGRATION IN GOLD-FILMS
KINSBRON, E
BLECH, IA
KOMEM, Y
[J]. THIN SOLID FILMS, 1977, 46 (02) : 139 - 150
[10] EFFECT OF STRUCTURE AND PROCESSING ON ELECTROMIGRATION-INDUCED FAILURE IN ANODIZED ALUMINUM
LEARN, AJ
[J]. JOURNAL OF APPLIED PHYSICS, 1973, 44 (03) : 1251 - 1258