THE EFFECT OF PASSIVATION THICKNESS ON THE ELECTROMIGRATION LIFETIME OF AL/CU THIN-FILM CONDUCTORS

被引：64

作者：

LLOYD, JR

SMITH, PM

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1983年 / 1卷 / 02期

关键词：

D O I：

10.1116/1.571946

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

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页码：455 / 458

页数：4

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