ELECTROMIGRATION IN AL-CU THIN-FILMS WITH POLYIMIDE PASSIVATION

被引：17

作者：

LLOYD, JR

机构：

来源：

THIN SOLID FILMS | 1982年 / 91卷 / 02期

关键词：

D O I：

10.1016/0040-6090(82)90431-X

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

收藏

页码：175 / 182

页数：8

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