GRAIN-BOUNDARY AND VACANCY DIFFUSION-MODEL FOR ELECTROMIGRATION-INDUCED DAMAGE IN THIN-FILM CONDUCTORS

被引：16

作者：

LLOYD, JR ^{[1
]}

NAKAHARA, S ^{[1
]}

机构：

[1] BELL TEL LABS INC,MURRAY HILL,NJ 07974

来源：

THIN SOLID FILMS | 1980年 / 72卷 / 03期

关键词：

D O I：

10.1016/0040-6090(80)90530-1

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：451 / 456

页数：6

共 17 条

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[6]

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[7]

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[8]

LLOYD JA, UNPUBLISHED

[9] EFFECT OF HIGH D.C. DENSITY STRESSING ON PRE-EXISTING VOIDS IN THIN GOLD-FILMS [J].

LLOYD, JR ;

NAKAHARA, S .

THIN SOLID FILMS, 1979, 64 (01) :163-169

[10] LOW-TEMPERATURE VOID GROWTH AND RESISTIVITY DECAY IN THIN EVAPORATED GOLD-FILMS [J].

LLOYD, JR ;

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THIN SOLID FILMS, 1977, 45 (02) :411-420

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