EFFECT OF HIGH D.C. DENSITY STRESSING ON PRE-EXISTING VOIDS IN THIN GOLD-FILMS

被引：15

作者：

LLOYD, JR

NAKAHARA, S

机构：

[1] STEVENS INST TECHNOL,HOBOKEN,NJ 07030

[2] BELL TEL LABS INC,MURRAY HILL,NJ 07974

来源：

THIN SOLID FILMS | 1979年 / 64卷 / 01期

关键词：

D O I：

10.1016/0040-6090(79)90555-8

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The structure of evaporated thin gold films subjected to high d.c. density stressing (approximately 2 × 106 A cm-2 for 1000 h) was studied using a transmission electron microscope. The growth of small voids (less than 50 Å in size) pre-existing in the as-deposited gold films was examined after the films had been subjected to the d.c. stressing. The possible role of these pre-existing voids in electromigration-induced damage of thin film conductors is discussed. © 1979.

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页码：163 / 169

页数：7

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