CR-CU AND CR-CU-CR THIN-FILM METALLIZATION

被引：11

作者：

ONEILL, JJ ^{[1
]}

VOSSEN, JL ^{[1
]}

机构：

[1] RCA CORP,DAVID SARNOFF RES CTR,PRINCETON,NJ 08540

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1973年 / 10卷 / 04期

关键词：

D O I：

10.1116/1.1318059

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

A systematic study was made of interactions and stability of thin film sandwiches of Cr-Cu and Cr-Cu-Cr, such as used in microwave strip lines and hybrid integrated circuits. Resistometric and electron diffraction measurements were made of diffusion, oxidation and resistivity stabilities of these films. They were found to be useful up to 175 C in oxidizing environments.

引用

页码：533 / 538

页数：6

共 43 条

[21]

HUNTER MA, 1917, J AM I MET, V11, P115

[22]

KENDRICK PS, 1968, NATURE, V217, P1249

[23]

KOFSTAD P, 1972, NONSTIOCHIOMETRY DIF

[24] SOME ANOMALIES IN ELECTRICAL AND MAGNETIC PROPERTIES OF DILUTE CU-CR ALLOYS DURING PRECIPITATION [J].

KOVACS, I ;

SZENES, G .

PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1971, 5 (01) :231-&

[25]

LOGAN MA, 1959, BELL SYST TECH J, V40, P885

[26] OXIDATION KINETICS IN THE CASE OF AGEING OXIDE FILMS [J].

MEIJERING, JL ;

VERHEIJKE, ML .

ACTA METALLURGICA, 1959, 7 (05) :331-338

[27]

MOTT NF, 1958, THEORY METALS ALLOYS

[28] ROOM-TEMPERATURE RECRYSTALLIZATION IN THICK BIAS-SPUTTERED COPPER DEPOSITS [J].

PATTEN, JW ;

MCCLANAHAN, ED ;

JOHNSTON, JW .

JOURNAL OF APPLIED PHYSICS, 1971, 42 (11) :4371-+

[29]

PINNEL MR, 1972, METALL TRANS, V3, P1989, DOI 10.1007/BF02642589

[30] INTERDIFFUSION IN THIN CONDUCTOR FILMS - CHROMIUM/GOLD, NICKEL/GOLD AND CHROMIUM SILICIDE/GOLD [J].

RAIRDEN, JR ;

NEUGEBAU.CA ;

SIGSBEE, RA .

METALLURGICAL TRANSACTIONS, 1971, 2 (03) :719-+

← 1 2 3 4 5 →