REACTIVE ARC VAPOR ION DEPOSITION OF TIN, ZRN AND HFN

被引：51

作者：

JOHANSEN, OA

DONTJE, JH

ZENNER, RLD

机构：

[1] Andal Corp, St. Paul, MN, USA, Andal Corp, St. Paul, MN, USA

来源：

THIN SOLID FILMS | 1987年 / 153卷

关键词：

D O I：

10.1016/0040-6090(87)90171-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：75 / 82

页数：8

共 21 条

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[4] THE SCRATCH TEST ADHESION OF TIC DEPOSITED INDUSTRIALLY BY CHEMICAL VAPOR-DEPOSITION ON STEEL
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[5] THE MICROSTRUCTURE OF REACTIVELY SPUTTERED TI-N FILMS
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[6] MORPHOLOGY AND PROPERTIES OF SPUTTERED HFN LAYERS AS A FUNCTION OF SUBSTRATE-TEMPERATURE AND SPUTTERING ATMOSPHERE
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[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (06): : 2406 - 2410
[7] MARTIN PJ, 1987, J VAC SCI TECHNOL A, V5
[8] PROBLEMS IN THE PHYSICAL VAPOR-DEPOSITION OF TITANIUM NITRIDE
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LEFKOW, AR
[J]. THIN SOLID FILMS, 1985, 126 (3-4) : 283 - 291
[9] INFLUENCE OF OXYGEN ON ADHERENCE OF GOLD FILMS TO OXIDE SUBSTRATES
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[10] TI-N PHASES FORMED BY REACTIVE ION PLATING
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[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (06): : 2419 - 2425

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