DIFFUSION PROCESSES AT CU-CDTE INTERFACE FOR EVAPORATED AND CHEMICALLY PLATED CU LAYERS

被引：12

作者：

MANN, H

LINKER, G

MEYER, O

机构：

来源：

SOLID STATE COMMUNICATIONS | 1972年 / 11卷 / 03期

关键词：

D O I：

10.1016/0038-1098(72)90035-X

中图分类号：

O469 [凝聚态物理学];

学科分类号：

070205 ;

摘要：

引用

页码：475 / &

共 9 条

[1]

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[7] CHANNELING-EFFECT ANALYSIS OF THIN FILMS ON SILICON - ALUMINUM OXIDE [J].

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[8]

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[9] SOME DIFFUSION AND SOLUBILITY MEASUREMENTS OF CU IN CDTE [J].

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