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Thermal characterization of diamond-pressure-bond heat sinking for optically pumped mid-infrared lasers

被引：25
作者：
Bewley, WW [1 ]
Felix, CL
Aifer, EH
Stokes, DW
Vurgaftman, I
Olafsen, LJ
Meyer, JR
Yang, MJ
Lee, H
机构：
[1] USN, Res Lab, Washington, DC 20375 USA
[2] Sarnoff Corp, Princeton, NJ 08543 USA
来源：
IEEE JOURNAL OF QUANTUM ELECTRONICS | 1999年 / 35卷 / 11期
关键词：
CW lasers; laser thermal factors; mid-infrared lasers; quantum-well lasers; semiconductor lasers;
D O I：
10.1109/3.798081
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The heat sinking properties of optically pumped semiconductor lasers mounted by the diamond-pressure-bonding (DPB) technique have been evaluated quantitatively. This method combines epi-side-down mounting with minimal processing and top optical access via pumping through the diamond. By correlating the pump-intensity variation of the emission wavelength with its temperature variation, specific thermal resistances have been determined for DPB-mounted type-II "W" lasers operating in the mid-infrared. Values less than or equal to 2.0 K.cm(2)/kW were obtained for all temperatures in the range 140-220 K.
引用
收藏
页码：1597 / 1601
页数：5
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