GaN and InGaN prepared by hot wall beam epitaxy

被引:3
作者
Sakakibara, S
Tanoue, F
Ohbora, M
Kaneko, M
Nakayama, T
Ishino, K
Ishida, A
Fujiyasu, H
机构
[1] YAMAHA, R&D Div, Elect Devices Grp, Toyooma, Shiga 4380192, Japan
[2] Shizuoka Univ, Fac Engn, Hamamatsu, Shizuoka 4328561, Japan
关键词
GaN; InGaN; hot wall epitaxy (HWE); GaN buffer layer; X-ray diffraction; photoluminescence (PL); electrical property;
D O I
10.1016/S0169-4332(98)00884-8
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
GaN and InGaN epilayers were successfully obtained on nitrided Ga buffer layers predeposited on the sapphire (0001) substrate by Not Wall Beam Epitaxy (HWBE) using Ga and/or In metals, NH3 gas or RF plasma nitrogen source. For both films, the surface morphology was smooth and the PL spectra showed strong near-band-edge emission without deep level emission. For the InGaN films, the highest In mole fraction of 24% was obtained with the substrate temperature (T-sub) of 575 and the RF power of 500 W, which was estimated from the shift of X-ray diffraction peak. (C) 1999 published by Elsevier Science B.V. All rights reserved.
引用
收藏
页码:362 / 366
页数:5
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