Fabrication of Silicon-Oxide Thin Film by Using Ionized Physical Vapor Deposition and Application to Gate Insulators in Transparent Thin-Film Transistors

被引:1
作者
Cheong, Woo-Seok [1 ]
Hwang, Chi-Sun [1 ]
Shin, Jae-Heon [1 ]
Park, Sang-Hee Ko [1 ]
Yoon, Sung-Min [1 ]
Cho, Doo-Hee [1 ]
Ryu, Minki [1 ]
Byun, Chun-Won [1 ]
Yang, Shinhyuk [1 ]
Chu, Hye Yong [1 ]
Cho, Kyoung Ik [1 ]
机构
[1] Elect & Telecommun Res Inst, Transparent Elect Team, Taejon 305350, South Korea
关键词
IPVD; Ionized physical vapor deposition; Silicon oxide; Transparent thin-film transistor;
D O I
10.3938/jkps.54.473
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
Using an ionized physical vapor deposition (IPVD) apparatus, we formed a low-temperature silicon-oxide gate insulator (GI) for top-gate-type In-Ga-Zn oxide channel transparent thin-film transistors (IGZO-TTFTs) for the first time. IGZO-TTFTs with SiOx GIs (100 nm) showed a low gate leakage current of about 10(-12) A up to 30 V (gate voltage) comparable to all AlOx GI fabricated by atomic layer deposition (ALD). However, it had a high drain off-current (similar to 10(-8) A) with a low drain current, on-off ratio of similar to 10(-2) A due to the inductively coupled plasma (ICP) stream during the IPVD-GI process. In order to protect; an IGZO channel layer from the plasma effect., we deposited a shallow AlOx (10 nm) layer on the IGZO by using ALD. Using this double-layered GI, a high mobility transistor (30.95 cm(2)/sV) with a drain current on-off ratio of similar to 10(6) could be achieved.
引用
收藏
页码:473 / 477
页数:5
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