Fabrication of periodic nickel silicide nanodot arrays using nanosphere lithography

被引:10
作者
Cheng, SL [1 ]
Lu, SW
Li, CH
Chang, YC
Huang, CK
Chen, H
机构
[1] Natl Cent Univ, Dept Chem & Mat Engn, Chungli, Taoyuan, Taiwan
[2] Natl Cent Univ, Inst Mat Sci & Engn, Chungli, Taoyuan, Taiwan
关键词
nanosphere lithography; epitaxy; silicide nanodots; nanowires;
D O I
10.1016/j.tsf.2005.08.158
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The interfacial reactions of the 2D-ordered nickel metal nanodots that were prepared by polystyrene nanosphere lithography (NSL) on Si substrates after different heat treatments have been investigated. Epitaxial NiSi2 nanodot arrays were found to form at a temperature as low as 350 degrees C. The results indicated that the growth of epitaxial NiSi2 is more favorable for the Ni metal dot array samples. The sizes of these epitaxial NiSi2 nanodots in samples annealed at 350-800 degrees C are in the range of 84-110 nm. The shape of the epitaxial NiSi2 nanodot was found to be pyramidal. Furthermore, for the samples annealed at 900 degrees C, amorphous SiOx nanowires were found to grow on individual nickel silicide nanoparticles. The diameters of these nanowires are in the range of 15-20 nm. As the size of metal nanodot can be adjusted by tuning the diameter of the polystyrene (PS) spheres, the NSL technique promises to be an effective patterning method without complex lithography. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码:307 / 310
页数:4
相关论文
共 21 条
[1]   EPITAXIAL-GROWTH OF COSI2 ON SI WAFER USING CO/TA BILAYER [J].
BYUN, JS ;
KANG, SB ;
KIM, HJ ;
KIM, CY ;
PARK, KH .
JOURNAL OF APPLIED PHYSICS, 1993, 74 (05) :3156-3161
[2]   FORMATION OF EPITAXIAL NISI2 OF SINGLE ORIENTATION ON(111) SI INSIDE MINIATURE SIZE OXIDE OPENINGS [J].
CHANG, CS ;
NIEH, CW ;
CHEN, LJ .
APPLIED PHYSICS LETTERS, 1987, 50 (05) :259-261
[3]   FORMATION AND STRUCTURE OF EPITAXIAL NISI2 AND COSI2 [J].
CHEN, LJ ;
MAYER, JW ;
TU, KN .
THIN SOLID FILMS, 1982, 93 (1-2) :135-141
[4]   DIFFUSION IN INTERMETALLIC COMPOUNDS WITH THE CAF2 STRUCTURE - A MARKER STUDY OF THE FORMATION OF NISI2 THIN-FILMS [J].
DHEURLE, F ;
PETERSSON, S ;
STOLT, L ;
STRIZKER, B .
JOURNAL OF APPLIED PHYSICS, 1982, 53 (08) :5678-5681
[5]   INTERFACIAL REACTION BARRIERS DURING THIN-FILM SOLID-STATE REACTIONS - THE CRYSTALLOGRAPHIC ORIGIN OF KINETIC BARRIERS AT THE NIS2/SI(111) INTERFACE [J].
HESSE, D ;
WERNER, P ;
MATTHEIS, R ;
HEYDENREICH, J .
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 1993, 57 (05) :415-425
[6]   Growth of large periodic arrays of carbon nanotubes [J].
Huang, ZP ;
Carnahan, DL ;
Rybczynski, J ;
Giersig, M ;
Sennett, M ;
Wang, DZ ;
Wen, JG ;
Kempa, K ;
Ren, ZF .
APPLIED PHYSICS LETTERS, 2003, 82 (03) :460-462
[7]   NANOSPHERE LITHOGRAPHY - A MATERIALS GENERAL FABRICATION PROCESS FOR PERIODIC PARTICLE ARRAY SURFACES [J].
HULTEEN, JC ;
VANDUYNE, RP .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1995, 13 (03) :1553-1558
[8]   KINETICS AND NUCLEATION MODEL OF THE C49 TO C54 PHASE-TRANSFORMATION IN TISI2 THIN-FILMS ON DEEP-SUB-MICRON N(+) TYPE POLYCRYSTALLINE SILICON LINES [J].
KITTL, JA ;
PRINSLOW, DA ;
APTE, PP ;
PAS, MF .
APPLIED PHYSICS LETTERS, 1995, 67 (16) :2308-2310
[9]   COMPARISON OF TRANSFORMATION TO LOW-RESISTIVITY PHASE AND AGGLOMERATION OF TISI2 AND COSI2 [J].
LASKY, JB ;
NAKOS, JS ;
CAIN, OJ ;
GEISS, PJ .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1991, 38 (02) :262-269
[10]   Towards implementation of a nickel silicide process for CMOS technologies [J].
Lavoie, C ;
d'Heurle, FM ;
Detavernier, C ;
Cabral, C .
MICROELECTRONIC ENGINEERING, 2003, 70 (2-4) :144-157