Ionized physical vapor deposition of titanium nitride: Plasma and film characterization

被引:31
作者
Mao, D [1 ]
Tao, K [1 ]
Hopwood, J [1 ]
机构
[1] Northeastern Univ, Boston, MA 02115 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 2002年 / 20卷 / 02期
关键词
D O I
10.1116/1.1446448
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The ionized physical vapor deposition of titanium nitride is experimentally investigated in terms of both plasma characteristics and TiN material properties. The vibrational and translational (gas temperatures of N-2 molecules are determined using optical emission spectroscopy by fitting the intensities of vibrational transitions to the nonequilibrium Treanor distribution. The gas temperature is typically 720 K at 15 mTorr. The dissociation of nitrogen is determined using mass spectrometry and found to increase with plasma power from 10% to 30% as the power is increased from 750 to 1500 W. From this data, it is calculated that the density of atomic nitrogen in the inductively coupled plasma source is the order of 10(12) cm(-3). Langmuir probe measurements indicate that the electron temperature is 1.6-2.0 eV and the ion density is (2-6) X 10(11) cm(-3). Rutherford backscattering spectroscopy (RBS) shows that the TiN, films have increasing nitrogen composition (0.26<x < 1.5) as the nitrogen content increases from 2% to 9% in the Ar/N-2 plasma. The flux of nitrogen atoms from the plasma, as determined from the measured gas temperature and dissociation, is compared with the flux of nitrogen that is incorporated in the film according to RBS. The ratio of these two fluxes gives an upper-bound for the sticking coefficient of atomic N on TiNx, which is similar to0.1 for titanium-rich films and similar to0.003 for nitrogen-rich films. (C) 2002 American Vacuum Society.
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页码:379 / 387
页数:9
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