Fabrication process for ultra high aspect ratio polysilazane-derived MEMS

被引：8

作者：

Cross, T ^{[1
]}

Liew, LA ^{[1
]}

Bright, VM ^{[1
]}

Dunn, ML ^{[1
]}

Daily, JW ^{[1
]}

Raj, R ^{[1
]}

机构：

[1] Univ Colorado, High Temp Mat Lab, Ctr Adv Mfg & Packaging Microwave Opt & Digital E, Boulder, CO 80309 USA

来源：

FIFTEENTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2002年

关键词：

D O I：

10.1109/MEMSYS.2002.984232

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We present a new process for fabricating polysilazane-derived MEMS components with ultra high aspect ratios. The width-to-height ratio of actual structures fabricated at this time is (similar to20: 1), but shows promising results to achieve aspect ratios of 50:1. Polysilazane-derived materials are a group of polymers and ceramics that can be fanctionalized to have a wide range of material properties such as electronic, magnetic, dielectric, and optical. The fabrication process is based on contact lithography of a liquid photopolymer precursor, poly urea methyl vinyl silazane, PUMVS (Kion, Corp.), with photoinitiator 2,2 dimethoxy, 2-acetophenone, DNPA (Aldrich) for polysilazane. Contact lithography of aqueous photopolymers presents a substantial improvement in resolution, flatness of structures, and aspect ratios compared to microcasting, and proximity printing for polysilazane-derived MEMS. In the future, this fabrication technique may be extended beyond polysilazane-derived materials to a wide variety of aqueous photopolymerizable sol-gels, preceramics, and photopolymers.

引用

页码：172 / 175

页数：4

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