Fabrication and electrical characterization of planar resonant tunneling devices incorporating InAs self-assembled quantum dots

被引:19
作者
Jung, SK [1 ]
Hyon, CK
Park, JH
Hwang, SW
Ahn, D
Son, MH
Min, BD
Kim, Y
Kim, EK
机构
[1] Korea Univ, Sch Elect Engn, Seoul 136701, South Korea
[2] Univ Seoul, Inst Quantum Informat Proc & Syst, Seoul 130743, South Korea
[3] Korea Inst Sci & Technol, Semicond Mat Lab, Seoul 130650, South Korea
关键词
D O I
10.1063/1.124631
中图分类号
O59 [应用物理学];
学科分类号
摘要
Planar-type quantum-dot devices have been fabricated and characterized. Aluminum metal electrodes with interelectrode spacing of 30 nm have been deposited on an InAs self-assembled quantum-dot wafer to form the quantum-dot devices. The current-voltage characteristics measured from the devices, in which a single quantum dot is placed in between the electrodes, exhibit negative differential resistance effects at the temperature above 77 K. They are interpreted as due to three-dimensional-zero-dimensional resonant tunneling through the InAs self-assembled quantum dot. (C) 1999 American Institute of Physics. [S0003-6951(99)03734-1].
引用
收藏
页码:1167 / 1169
页数:3
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