Optimisation of electronic interface properties of a-Si:H/c-Si hetero-junction solar cells by wet-chemical surface pre-treatment

被引:48
作者
Angermann, H. [1 ]
Korte, L. [1 ]
Rappich, J. [1 ]
Conrad, E. [1 ]
Sieber, I. [1 ]
Schmidt, M. [1 ]
Huebener, K. [2 ]
Hauschild, J. [2 ]
机构
[1] Hahn Meitner Inst Berlin GmbH, Abt Siliziumphotovolta, D-12489 Berlin, Germany
[2] Free Univ Berlin, FB Phys, D-14195 Berlin, Germany
基金
中国国家自然科学基金;
关键词
a-Si : H/c-Si hetero-junction solar cells; wet-chemical pre-treatment; silicon substrates; interface state density; recombination loss; surface photovoltage; photoluminescence; atomic force microscopy;
D O I
10.1016/j.tsf.2007.12.033
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The relation between structural imperfections at structured silicon surfaces, energetic distribution of interface state densities, recombination loss at a-Si:H/c-Si interfaces and solar cell characteristics have been intensively investigated using non-destructive, surface sensitive techniques, surface photovoltage (SPV) and photoluminescence (PL) measurements, atomic force microscopy (AFM) and electron microscopy (SEM). Sequences of wet-chemical oxidation and etching steps were optimised with respect to the etching behaviour of Si(111) pyramids. Special wet-chemical smoothing and oxide removal procedures for structured substrates were developed, in order to reduce the preparation-induced surface micro-roughness and density of electronically active defects. H-termination and passivation by wet-chemical oxides were used to inhibit surface contamination and native oxidation during the technological process. We achieved significantly lower micro-roughness, densities of surface states D-it(E) and recombination loss at a-Si:H/c-Si interfaces on wafers with randomly distributed pyramids, compared to conventional pre-treatments. For amorphous-crystal line hetero-junction solar cells (ZnO/a-Si:H/c-Si/BSF/Al), the c-Si surface becomes part of the a-Si:HJc-Si interface, whose recombination activity determines cell performance. With textured substrates, the smoothening procedure results in a significant increase of short circuit current, fill factor and efficiency. (c) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:6775 / 6781
页数:7
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