Impact of conductivity and size of the breakdown spot on the progressive-breakdown of thin SiO2 gate oxides

被引:5
作者
Porti, M [1 ]
Nafría, M [1 ]
Aymerich, X [1 ]
机构
[1] Univ Autonoma Barcelona, Dept Elect Engn, E-08193 Bellaterra, Spain
关键词
dielectric breakdown; progressive breakdown; SiO2; films; conductive atomic force microscope;
D O I
10.1016/j.mee.2003.12.011
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work, for the first time, a conductive atomic force microscope has been used to electrically characterize the progressiveness of the breakdown phenomenon of stressed thin (2.9 and 4.2 nm) SiO2 films at a nanometer scale. The extremely high lateral resolution of the technique allows to analyse independently the role of the oxide conductivity and the area of the breakdown (BD) spot. In particular, the results show that the gradual increase of the overall current that flows through the broken down oxide area is the consequence of the progressive growth of both parameters: the oxide conductivity at the location where BD was initially triggered and the size of the BD spot. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:29 / 33
页数:5
相关论文
共 16 条
[1]   Macroscopic and microscopic studies of electrical properties of very thin silicon dioxide subject to electrical stress [J].
Daniel, ES ;
Jones, JT ;
Marsh, OJ ;
McGill, TC .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1997, 15 (04) :1089-1096
[2]   Characterization of thin and ultra-thin SiO2 films and SiO2/Si interfaces with combined conducting and topographic atomic force microscopy [J].
Frammelsberger, W ;
Benstetter, G ;
Schweinboeck, T ;
Stamp, RJ ;
Kiely, J .
MICROELECTRONICS RELIABILITY, 2003, 43 (9-11) :1465-1470
[3]   Ballistic-electron emission microscopy studies of charge trapping in SiO2 [J].
Kaczer, B ;
Pelz, JP .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1996, 14 (04) :2864-2871
[4]   Impact of MOSFET gate oxide breakdown on digital circuit operation and reliability [J].
Kaczer, B ;
Degraeve, R ;
Rasras, M ;
Van de Mieroop, K ;
Roussel, PJ ;
Groeseneken, G .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2002, 49 (03) :500-506
[5]   Voltage dependence of hard breakdown growth and the reliability implication in thin dielectrics [J].
Linder, BP ;
Lombardo, S ;
Stathis, JH ;
Vayshenker, A ;
Frank, DJ .
IEEE ELECTRON DEVICE LETTERS, 2002, 23 (11) :661-663
[6]   Evidence for defect-generation-driven wear-out of breakdown conduction path in ultra thin oxides [J].
Monsieur, F ;
Vincent, E ;
Ribes, G ;
Huard, V ;
Bruyère, S ;
Roy, D ;
Pananakakis, G ;
Ghibaudo, G .
41ST ANNUAL PROCEEDINGS: INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2003, :424-431
[7]   A thorough investigation of progressive breakdown in ultra-thin oxides. Physical understanding and application for industrial reliability assessment. [J].
Monsieur, F ;
Vincent, E ;
Roy, D ;
Bruyere, S ;
Vildeuil, JC ;
Pananakakis, G ;
Ghibaudo, G .
40TH ANNUAL PROCEEDINGS: INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2002, :45-54
[8]   Nanoscale electrical characterization of thin oxides with conducting Atomic Force Microscopy [J].
Olbrich, A ;
Ebersberger, B ;
Boit, C .
1998 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 36TH ANNUAL, 1998, :163-168
[9]   CONDUCTING ATOMIC-FORCE MICROSCOPY STUDY OF SILICON DIOXIDE BREAKDOWN [J].
OSHEA, SJ ;
ATTA, RM ;
MURRELL, MP ;
WELLAND, ME .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1995, 13 (05) :1945-1952
[10]   Imaging breakdown spots in SiO2 films and MOS devices with a Conductive Atomic Force Microscope [J].
Porti, M ;
Blüm, MC ;
Nafría, M ;
Aymerich, X .
40TH ANNUAL PROCEEDINGS: INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2002, :380-386