Thermal interface material with aligned CNT and its application in HB-LED packaging

被引：29

作者：

Zhang, K. ^{[1
]}

Yuen, Matthew M. F. ^{[1
]}

Wang, N. ^{[1
]}

Miao, J. Y. ^{[1
]}

Xiao, David G. W. ^{[1
]}

Fan, H. B. ^{[1
]}

机构：

[1] Hong Kong Univ Sci & Technol, Dept Mech Engn, Clear Water Bay, Kowloon, Hong Kong, Peoples R China

来源：

56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS | 2006年

关键词：

D O I：

10.1109/ECTC.2006.1645644

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

High density, well aligned vertical CNT arrays were synthesized by thermal chemical vapor deposition (CVD) method on 1 inch by 1 inch Si substrates with sputtered Ti and Si layers. They were used as a new kind of thermal interface material (TIM) for the thermal management of microelectronic packages and high brightness light emitting diode (HB-LED) packages. The thermal resistance of the CNT-array-TIM and some other TIM were evaluated and compared according to ASTM D5470 standard. The thermal resistance of CNT-array-TIM was found to be 15 mm(2)center dot K/W which was only 20% of that of the commercial silver epoxy. The mechanism of the phonon heat transfer through the CNT-array-TIM was reviewed. The application performance of CNT-array-TIM in HB-LED packages was predicted by finite element analysis using ANSYS code. It was concluded that CNT arrays synthesized by the simple thermal CVD procedure is a promising low cost and effective TIM.

引用

页码：177 / +

页数：2

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