Evaluation of size effect on mechanical properties of single crystal silicon by nanoscale bending test using AFM

被引:318
作者
Namazu, T [1 ]
Isono, Y [1 ]
Tanaka, T [1 ]
机构
[1] Ritsumeikan Univ, Fac Sci & Engn, Dept Mech Engn, Shiga 5258577, Japan
关键词
atomic force microscope (AFM); bending strength; field emission scanning electron microscope (FE-SEM); nanoscale bending test; size effect; surface roughness; Weibull parameters; Young's modulus;
D O I
10.1109/84.896765
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes a nanometer-scale bending test for a single crustal silicon (Si) fixed beam using an atomic force microscope (AFM). This research focuses on revealing the size effect on the mechanical property of Si beams ranging from a nano- to millimeter scale, Nanometer-scale Si beams, with widths from 200 to 800 nm and a thickness of 255 nm, were fabricated on an Si diaphragm by means of field-enhanced anodization using AFM and anisotropic wet etching, The efficient condition of the held-enhanced anodization could be obtained by changing the bias voltage and the scanning speed of the cantilever. Bending tests for micro- and millimeter-scale Si beams fabricated by a photolithography technique were also carried out using an ultraprecision hardness tester and scratch tester, respectively. Comparisons of Young's modulus and bending strength of Si among the nano-, micro-, and millimeter scales showed that the specimen size did not have an influence on the Young's modulus in the [110] direction, whereas it produced a large effect on the bending strength. Observations of the fractured surface and calculations of the clack length from Griffith's theory made it clear that the maximum peak-to-valley distance of specimen surface caused the size effect on the bending strength.
引用
收藏
页码:450 / 459
页数:10
相关论文
共 22 条
  • [1] Davies D.G.S., 1973, P BRIT CERAMIC SOC, V22, P429
  • [2] MICROMECHANICAL FRACTURE STRENGTH OF SILICON
    ERICSON, F
    SCHWEITZ, JA
    [J]. JOURNAL OF APPLIED PHYSICS, 1990, 68 (11) : 5840 - 5844
  • [3] Gerlach G, 1996, SENSOR MATER, V8, P79
  • [4] Mechanical characterization of thick polysilicon films:: Young's modulus and fracture strength evaluated with microstructures
    Greek, S
    Ericson, F
    Johansson, S
    Fürtsch, M
    Rump, A
    [J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1999, 9 (03) : 245 - 251
  • [5] Griffith A.A., 1921, PHILOS T R SOC LOND, V221, P163, DOI DOI 10.1098/RSTA.1921.0006
  • [6] GUPTA DC, 1983, SILICON PROCESSING, P125
  • [7] FABRICATION OF NANOMETER-SCALE STRUCTURES USING ATOMIC-FORCE MICROSCOPE WITH CONDUCTING PROBE
    HATTORI, T
    EJIRI, Y
    SAITO, K
    YASUTAKE, M
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 1994, 12 (04): : 2586 - 2590
  • [8] FRACTURE TESTING OF SILICON MICROELEMENTS INSITU IN A SCANNING ELECTRON-MICROSCOPE
    JOHANSSON, S
    SCHWEITZ, JA
    TENERZ, L
    TIREN, J
    [J]. JOURNAL OF APPLIED PHYSICS, 1988, 63 (10) : 4799 - 4803
  • [9] Kovacs G. T., 1998, MICROMACHINED TRANSD, P179
  • [10] RESIDUAL-STRESSES AND FRACTURE PROPERTIES OF MAGNETRON-SPUTTERED TI FILMS ON SI MICROELEMENTS
    LJUNGCRANTZ, H
    HULTMAN, L
    SUNDGREN, JE
    JOHANSSON, S
    KRISTENSEN, N
    SCHWEITZ, JA
    SHUTE, CJ
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1993, 11 (03): : 543 - 553