共 10 条
[1]
CHOMNAWANG N, CHIP 3D MICRO INDUCT
[2]
Wafer through-hole interconnections with high vertical wiring densities
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A,
1996, 19 (04)
:516-522
[4]
Photolithography in anisotropically etched grooves
[J].
NINTH ANNUAL INTERNATIONAL WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS, IEEE PROCEEDINGS: AN INVESTIGATION OF MICRO STRUCTURES, SENSORS, ACTUATORS, MACHINES AND SYSTEMS,
1996,
:38-43
[6]
NIEUWENHUIZEN JM, 1966, PHILIPS TECH REV, V27, P87
[7]
PREPARATION OF C-AXIS-ORIENTED PBTIO3 THIN-FILMS BY MOCVD UNDER REDUCED PRESSURE
[J].
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS,
1989, 28 (06)
:1030-1034
[8]
Parodi M., 1996, Semiconductor International, V19, P101