Intrinsic gettering in nitrogen-doped and hydrogen-annealed Czochralski-grown silicon wafers

被引:13
作者
Goto, H
Pan, LS
Tanaka, M
Kashima, K
机构
[1] Toshiba Ceram Co Ltd, Silicon Div, Silicon Dev, Seirou, Niigata 9570197, Japan
[2] Toshiba Ceram Co Ltd, R&D Ctr, Kanagawa 2578566, Japan
[3] Toshiba Ceram Co Ltd, Silicon Div, Tech Applicat, Shinjuku Ku, Tokyo 1600023, Japan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 2001年 / 40卷 / 6A期
关键词
silicon wafer; nitrogen-doped; hydrogen-annealed; generation lifetime; intrinsic gettering; IG; nickel; oxygen precipitate;
D O I
10.1143/JJAP.40.3944
中图分类号
O59 [应用物理学];
学科分类号
摘要
The properties of nitrogen-doped and hydrogen-annealed Czochralski-grown silicon (NHA-CZ-Si) wafers were investigated in this study. The quality of the subsurface was investigated by monitoring the generation lifetime of minority carriers, as measured by the capacitance-time measurements of a metal oxide silicon capacitor (MOS C-t). The intrinsic gettering (IG) ability was investigated by determining the nickel concentration on the surface and in the subsurface as measured by graphite furnace atomic absorption spectrometry (GFAAS) after the wafer was deliberately contaminated with nickel. From the results obtained, the generation lifetimes of these NHA-CZ-Si wafers were determined to be almost the same as. or a little longer than those of epitaxial wafers, and the IG ability was proportional to the total volume of oxygen precipitates [i.e., bulk micro defects (BMDs)], which was influenced by the oxygen and nitrogen concentrations in the wafers. Therefore, it is suggested that the subsurface of the NHA-CZ-Si wafers is of good quality and the IG capacity is controllable by the nitrogen and oxygen concentrations in the wafers.
引用
收藏
页码:3944 / 3946
页数:3
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