Processing of PbTiO3 thin films .2. In situ investigation of stress relaxation

被引:5
作者
Li, CC [1 ]
Desu, SB [1 ]
机构
[1] VIRGINIA POLYTECH INST & STATE UNIV,DEPT MAT SCI & ENGN,BLACKSBURG,VA 24061
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1996年 / 14卷 / 01期
关键词
ALUMINUM FILMS; HILLOCK FORMATION; GROWTH;
D O I
10.1116/1.579883
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Stress relaxation in PbTiO3 films was investigated by the in situ stress measurement technique. A simple viscous flow model was successfully used to interpret the kinetics and behavior of stress relaxation of PbTiO3 thin films. The activation energy responsible for stress relaxation was estimated to be 190 kJ/mole, which was accounted for by the lattice diffusion of vacancies. A Nabarro-Herring creep model was successfully employed to correlate the relationships among the viscosity, lattice diffusion coefficient, and grain size of the PbTiO3 films, and an estimate of the lattice diffusion coefficient of vacancy motion during relaxation was obtained. Also, the observed time required for complete relaxation was found to be in accord with theoretical values. Hillock formation resulting from grain boundary sliding is believed to contribute to stress relaxation in its early stage. Thereafter, grain growth resulting from lattice diffusion is believed to play a major role in the stress relaxation. (C) 1996 American Vacuum Society.
引用
收藏
页码:7 / 12
页数:6
相关论文
共 26 条
[1]  
APBLETT CA, 1992, MATER RES SOC SYMP P, V239, P99
[2]   HILLOCK GROWTH IN THIN-FILMS [J].
CHAUDHAR.P .
JOURNAL OF APPLIED PHYSICS, 1974, 45 (10) :4339-4346
[3]   MECHANISMS OF STRESS RELIEF IN POLYCRYSTALLINE FILMS [J].
CHAUDHARI, P .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (02) :197-+
[4]  
COTTRELL AH, 1964, MECHANICAL PROPERTIE
[5]  
d'Heurle F. M., 1978, Thin films. Interdiffusion and reactions, P243
[6]   ALUMINUM FILMS DEPOSITED BY RF SPUTTERING [J].
DHEURLE, FM .
METALLURGICAL TRANSACTIONS, 1970, 1 (03) :725-&
[7]   ELECTROTRANSPORT IN COPPER ALLOY-FILMS AND DEFECT MECHANISM IN GRAIN-BOUNDARY DIFFUSION [J].
DHEURLE, FM ;
GANGULEE, A .
THIN SOLID FILMS, 1975, 25 (02) :531-544
[8]   STRESSES AND DEFORMATION PROCESSES IN THIN-FILMS ON SUBSTRATES [J].
DOERNER, MF ;
NIX, WD .
CRC CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES, 1988, 14 (03) :225-268
[9]  
Frost H J., 1982, Deformation-mechanismMaps: The Plasticity and Creep ofMetals and Ceramics
[10]  
GAS P, 1986, J APPL PHYS, V60, P163