GaAs MOSFET with oxide gate dielectric grown by atomic layer deposition

被引:191
作者
Ye, PD [1 ]
Wilk, GD [1 ]
Kwo, J [1 ]
Yang, B [1 ]
Gossmann, HJL [1 ]
Frei, M [1 ]
Chu, SNG [1 ]
Mannaerts, JP [1 ]
Sergent, M [1 ]
Hong, M [1 ]
Ng, KK [1 ]
Bude, J [1 ]
机构
[1] Agere Syst, Murray Hill, NJ 07974 USA
关键词
atomic layer deposition; depletion mode; GaAs MOSFET;
D O I
10.1109/LED.2003.812144
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
For the first time, a III-V compound semiconductor MOSFET with the gate dielectric grown by atomic layer deposition (ALD) is demonstrated. The novel application of the ALD process on III-V compound semiconductors affords tremendous functionality and opportunity by enabling the formation of high-quality gate oxides and passivation layers on III-V compound semiconductor devices. A 0.65-mum gate-length depletion-mode n-channel GaAs MOSFET with an Al2O3 gate oxide thickness of 160 Angstrom shows a gate leakage current density less than 10(-4) A/cm(2) and a maximum transconductance of 130 mS/mm, with negligible drain current drift and hysteresis. A short-circuit current-gain cut-off frequency f(T) of 14.0 GHz and a maximum oscillation frequency f(max) of 25.2 GHz have been achieved from a 0.65-mum gate-length device.
引用
收藏
页码:209 / 211
页数:3
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