Electrical contacts to ultrananocrystalline diamond

被引:47
作者
Gerbi, JE
Auciello, O
Birrell, J
Gruen, DM
Alphenaar, BW
Carlisle, JA
机构
[1] Argonne Natl Lab, Dept Mat Sci, Argonne, IL 60439 USA
[2] Univ Louisville, Dept Elect & Comp Engn, Louisville, KY 40292 USA
关键词
D O I
10.1063/1.1609043
中图分类号
O59 [应用物理学];
学科分类号
摘要
The contact behavior of various metals on n-type nitrogen-doped ultrananocrystalline diamond (UNCD) thin films has been investigated. The influences of the following parameters on the current-voltage characteristics of the contacts are presented: (1) electronegativity and work function of various metals, (2) an oxidizing acid surface cleaning step, and (3) oxide formation at the film/contact interface. Near-ideal ohmic contacts are formed in every case, while Schottky barrier contacts prove more elusive. These results counter most work discussed to date on thin diamond films, and are discussed in the context of the unique grain-boundary conductivity mechanism of the nitrogen-doped UNCD. (C) 2003 American Institute of Physics.
引用
收藏
页码:2001 / 2003
页数:3
相关论文
共 12 条
[1]  
ABDELMOTALEB IM, COMMUNICATION
[2]   Synthesis and characterization of highly-conducting nitrogen-doped ultrananocrystalline diamond films [J].
Bhattacharyya, S ;
Auciello, O ;
Birrell, J ;
Carlisle, JA ;
Curtiss, LA ;
Goyette, AN ;
Gruen, DM ;
Krauss, AR ;
Schlueter, J ;
Sumant, A ;
Zapol, P .
APPLIED PHYSICS LETTERS, 2001, 79 (10) :1441-1443
[3]   Bonding structure in nitrogen doped ultrananocrystalline diamond [J].
Birrell, J ;
Gerbi, JE ;
Auciello, O ;
Gibson, JM ;
Gruen, DM ;
Carlisle, JA .
JOURNAL OF APPLIED PHYSICS, 2003, 93 (09) :5606-5612
[4]   Morphology and electronic structure in nitrogen-doped ultrananocrystalline diamond [J].
Birrell, J ;
Carlisle, JA ;
Auciello, O ;
Gruen, DM ;
Gibson, JM .
APPLIED PHYSICS LETTERS, 2002, 81 (12) :2235-2237
[5]   Nanocrystalline diamond films [J].
Gruen, DM .
ANNUAL REVIEW OF MATERIALS SCIENCE, 1999, 29 :211-259
[6]   Ultrananocrystalline diamond thin films for MEMS and moving mechanical assembly devices [J].
Krauss, AR ;
Auciello, O ;
Gruen, DM ;
Jayatissa, A ;
Sumant, A ;
Tucek, J ;
Mancini, DC ;
Moldovan, N ;
Erdemir, A ;
Ersoy, D ;
Gardos, MN ;
Busmann, HG ;
Meyer, EM ;
Ding, MQ .
DIAMOND AND RELATED MATERIALS, 2001, 10 (11) :1952-1961
[7]   Progress towards high power thin film diamond transistors [J].
Looi, HJ ;
Pang, LYS ;
Whitfield, MD ;
Foord, JS ;
Jackman, RB .
DIAMOND AND RELATED MATERIALS, 1999, 8 (2-5) :966-971
[8]   A THERMALLY ACTIVATED SOLID-STATE REACTION PROCESS FOR FABRICATING OHMIC CONTACTS TO SEMICONDUCTING DIAMOND [J].
MOAZED, KL ;
ZEIDLER, JR ;
TAYLOR, MJ .
JOURNAL OF APPLIED PHYSICS, 1990, 68 (05) :2246-2254
[9]   Schottky junction properties of the high conductivity layer of diamond [J].
Takeuchi, D ;
Yamanaka, S ;
Okushi, H .
DIAMOND AND RELATED MATERIALS, 2002, 11 (3-6) :355-358
[10]   Ga Ohmic contact for n-type diamond by ion implantation [J].
Teraji, T ;
Koizumi, S ;
Kanda, H .
APPLIED PHYSICS LETTERS, 2000, 76 (10) :1303-1305