High-Density Stretchable Electronics: Toward an Integrated Multilayer Composite

被引：51

作者：

Guo, Liang ^{[1
,2
]}

DeWeerth, Stephen P. ^{[1
,2
]}

机构：

[1] Georgia Inst Technol, Wallace H Coulter Dept Biomed Engn, Atlanta, GA 30332 USA

[2] Emory Univ, Atlanta, GA 30332 USA

来源：

ADVANCED MATERIALS | 2010年 / 22卷 / 36期

基金：

美国国家卫生研究院;

关键词：

D O I：

10.1002/adma.201000515

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

High-density stretchable electronics are achieved using multilayer interconnects on an elastomeric substrate. Two major challenges associated with stretchable electronics-increasing integration density and improving electrical bonding-have been addressed by our innovative multilayer via-bonding technology. The resulting multichip-module architecture provides an elastic, high-density solution for numerous potential applications.

引用

页码：4030 / 4033

页数：4

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