Applications of LIGA technology to precision manufacturing of high-aspect-ratio micro-components and -systems: a review

被引:180
作者
Malek, CK
Saile, V
机构
[1] CNRS, Lab Phys & Metrol Oscillateurs, F-25044 Besancon, France
[2] Univ Karlsruhe, Inst Mikrostrukturtech, D-76021 Karlsruhe, Germany
[3] Forschungszentrum Karlsruhe, D-76021 Karlsruhe, Germany
[4] Angstromquelle Karlsruhe GmbH, ANKA, D-76021 Karlsruhe, Germany
关键词
LIGA; 3D-micromachining; high-aspect-ratio; micromechanics; microoptics; microfluidics;
D O I
10.1016/j.mejo.2003.10.003
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The by far leading technology for manufacturing MEMS devices is Si-micromachining with its various derivatives. However, many applications of microsystems have requirements on materials basis, geometry, aspect ratio, dimensions, shape, accuracy of microstructures, and number of parts that cannot be fulfilled easily by mainstream silicon-based micromachining technologies. LIGA, an alternative microfabrication process combining deep X-ray lithography, plating-through-mask and molding, enables the highly precise manufacture of high-aspect-ratio, microstructures with large structural height ranging from hundreds to thousands of micrometers thick. These tall microstructures can be produced in a variety of materials with well-defined geometry and dimensions, very straight and smooth sidewalls, and tight tolerances. LIGA technology is also well suited for mass fabrication of parts, particularly in polymer. Many microsystems benefit from unique characteristics and advantages of the LIGA process in terms of product performance. The LIGA technology is briefly reviewed. The strengths of the manufacturing method and its main fields of application are emphasized with examples taken from various groups worldwide, especially in micromechanics and microoptics. (C) 2003 Elsevier Ltd. All rights reserved.
引用
收藏
页码:131 / 143
页数:13
相关论文
共 212 条
[1]   Microsystem technology: Between research and industrial application [J].
Abraham, M ;
Ehrfeld, W ;
Hessel, V ;
Kamper, KP ;
Lacher, M ;
Picard, A .
MICROELECTRONIC ENGINEERING, 1998, 42 :47-52
[2]   Laterally movable gate FET (LMGFET) for on-chip integration of MEMS with electronics [J].
Ajmera, PK ;
Song, IH .
SMART STRUCTURES AND MATERIALS 2001: SMART ELECTRONICS AND MEMS, 2001, 4334 :30-37
[3]  
AKKARAJU S, 1996, SPIE P, V2880, P191
[4]   Development of tools for handling and assembling microcomponents [J].
Ansel, Y ;
Schmitz, F ;
Kunz, S ;
Gruber, HP ;
Popovic, G .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2002, 12 (04) :430-437
[5]  
BABA Y, 1998, P UTAS 98 WORKSH, P331
[6]   Fabrication of LIGA mold inserts [J].
Bacher, W ;
Bade, K ;
Matthis, B ;
Saumer, M ;
Schwarz, R .
MICROSYSTEM TECHNOLOGIES, 1998, 4 (03) :117-119
[7]   Microgrippers fabricated by the LIGA technique [J].
Ballandras, S ;
Basrour, S ;
Robert, L ;
Megtert, S ;
Blind, P ;
Rouillay, M ;
Bernede, P ;
Daniau, W .
SENSORS AND ACTUATORS A-PHYSICAL, 1997, 58 (03) :265-272
[8]   Manufacturing microcomponents for optical information technology using the LIGA technique [J].
Bauer, HD ;
Ehrfeld, W ;
Hossfeld, J ;
Paatzsch, T .
OPTICAL FABRICATION AND TESTING, 1999, 3739 :224-229
[9]  
BAUER HD, 2000, METALS, V1115, P13
[10]   Analysis of an optical energy interrupter for MEMS based safety and arming systems [J].
Beamesderfer, M ;
Chen, SP ;
DeVoe, D ;
Litcher, E ;
Johnson, K .
MEMS RELIABILITY FOR CRITICAL AND SPACE APPLICATIONS, 1999, 3880 :101-111