Frequency dispersion reduction and bond conversion on n-type GaAs by in situ surface oxide removal and passivation

被引:97
作者
Hinkle, C. L. [1 ]
Sonnet, A. M.
Vogel, E. M.
McDonnell, S.
Hughes, G. J.
Milojevic, M.
Lee, B.
Aguirre-Tostado, F. S.
Choi, K. J.
Kim, J.
Wallace, R. M.
机构
[1] Univ Texas, Dept Elect Engn, Richardson, TX 75080 USA
[2] Dublin City Univ, Sch Phys Sci, Dublin, Ireland
[3] Univ Texas, Mat Sci Engn, Richardson, TX 75080 USA
基金
爱尔兰科学基金会;
关键词
D O I
10.1063/1.2801512
中图分类号
O59 [应用物理学];
学科分类号
摘要
The method of surface preparation on n-type GaAs, even with the presence of an amorphous-Si interfacial passivation layer, is shown to be a critical step in the removal of accumulation capacitance frequency dispersion. In situ deposition and analysis techniques were used to study different surface preparations, including NH4OH, Si-flux, and atomic hydrogen exposures, as well as Si passivation depositions prior to in situ atomic layer deposition of Al2O3. As-O bonding was removed and a bond conversion process with Si deposition is observed. The accumulation capacitance frequency dispersion was removed only when a Si interlayer and a specific surface clean were combined. (C) 2007 American Institute of Physics.
引用
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页数:3
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