High-speed, high-accuracy optical measurements of polycrystalline silicon for process control

被引:5
作者
Benson, TE [1 ]
Ramamoorthy, A [1 ]
Kamlet, LI [1 ]
Terry, FL [1 ]
机构
[1] Univ Michigan, Dept Elect Engn & Comp Sci, Ann Arbor, MI 48109 USA
关键词
surface roughness; polycrystalline silicon; etch rate monitoring; process control;
D O I
10.1016/S0040-6090(97)00860-2
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Highly accurate non-contact polycrystalline silicon (poly-Si) film thickness measurements are important for both real-time feedback control and run-to-run control. Both spectroscopic ellipsometry (SE) and normal-incidence spectral reflectometry (SR) are complicated by poly-Si surface effects and variable bulk poly-Si refractive indices. In this article we will describe an empirical modification of Beckmann/Kirchhoff scattering theory to account for the effects of rough layers in SR. We will present results from in situ monitoring of reactive ion etching of poly-Si/SiO2/Si and ex situ comparisons to TEM and AFM. Preliminary conclusions on the applications of this model to SE analysis of poly-Si will also be presented. (C) 1998 Elsevier Science S.A.
引用
收藏
页码:435 / 441
页数:7
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