Microcontact printing (mu CP) and wet chemical etching generated two-dimensional (2D) patterns in thin silver films, Electroplating silver onto these patterns increased the structural integrity of the metal layer. Separating the metal film from the substrate resulted in free-standing, 2D structures. Folding of these structures along predesigned "hinges" produced three-dimensional (3D) objects. Additional electrodeposition of nickel welded hinges into position, strengthened the structure, and joined separate pieces. By printing onto cylindrical surfaces, it was possible to generate complex shapes efficiently and to minimize joining steps.
机构:Optical and Semiconductor Devices Section, Department of Electrical and Electronic Engineering, Imperial College of Science, Technology and Medicine, London
Green, PW
;
Syms, RRA
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机构:Optical and Semiconductor Devices Section, Department of Electrical and Electronic Engineering, Imperial College of Science, Technology and Medicine, London
Syms, RRA
;
Yeatman, EM
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机构:Optical and Semiconductor Devices Section, Department of Electrical and Electronic Engineering, Imperial College of Science, Technology and Medicine, London
机构:Optical and Semiconductor Devices Section, Department of Electrical and Electronic Engineering, Imperial College of Science, Technology and Medicine, London
Green, PW
;
Syms, RRA
论文数: 0引用数: 0
h-index: 0
机构:Optical and Semiconductor Devices Section, Department of Electrical and Electronic Engineering, Imperial College of Science, Technology and Medicine, London
Syms, RRA
;
Yeatman, EM
论文数: 0引用数: 0
h-index: 0
机构:Optical and Semiconductor Devices Section, Department of Electrical and Electronic Engineering, Imperial College of Science, Technology and Medicine, London