Tensile testing of silicon film having different crystallographic orientations carried out on a silicon chip

被引:114
作者
Sato, K
Yoshioka, T
Ando, T
Shikida, M
Kawabata, T
机构
[1] Nagoya Univ, Dept Micro Syst Engn, Chikusa Ku, Nagoya, Aichi 46401, Japan
[2] OMRON Corp, Cent R&D Lab, Nagoya, Aichi, Japan
关键词
tensile testing; silicon film;
D O I
10.1016/S0924-4247(98)00125-3
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Uniaxial tensile testing of single-crystal silicon film was carried out on a silicon chip. A tensile testing system was integrated on a silicon chip. A process for fabricating a test chip containing a specimen whose tensile axis has an arbitrary orientation was developed. The mechanical properties, such as elastic modulus and fracture strain, of silicon films having different orientations of [100], (110), and [111], are measured. The results are compared with those of bulk materials. (C) 1998 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:148 / 152
页数:5
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