Surface modification of (100) n-GaAs by radio frequency hydrogen plasmas

被引:7
作者
Sullivan, JL [1 ]
Saied, SO [1 ]
Layberry, R [1 ]
Cardwell, MJ [1 ]
机构
[1] Aston Univ, Dept Elect Engn & Appl Phys, Surface Sci Res Grp, Birmingham B4 7ET, W Midlands, England
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1998年 / 16卷 / 04期
关键词
D O I
10.1116/1.581383
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
This article describes a study of surface changes of (100) GaAs subjected to rf hydrogen plasma treatment. Hydrogen plasma etching of GaAs leads to the reduction of the As oxide in the native oxide film, leaving a wholly Ga oxide surface film. Further etching of the surface leads to the production of a nonstoichiometric subsurface amorphous GaAs layer which varies from Ga rich at low chamber pressures to As rich as the pressure is increased. This effect is dependent on the ion energy and may be explained in terms of the penetration depth of the hydrogen ions relative to the oxide thickness. (C) 1998 American Vacuum Society. [S0734-2101(98)09304-X].
引用
收藏
页码:2567 / 2571
页数:5
相关论文
共 17 条
[1]   AMMONIA PLASMA PASSIVATION OF GAAS IN DOWNSTREAM MICROWAVE AND RADIOFREQUENCY PARALLEL PLATE PLASMA REACTORS [J].
AYDIL, ES ;
GIAPIS, KP ;
GOTTSCHO, RA ;
DONNELLY, VM ;
YOON, E .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1993, 11 (02) :195-205
[2]   AN INVESTIGATION OF CH4/H-2 REACTIVE ION ETCHING DAMAGE TO THIN HEAVILY DOPED GAAS METAL-SEMICONDUCTOR FIELD-EFFECT TRANSISTOR LAYERS DURING GATE RECESSING [J].
CAMERON, NI ;
BEAUMONT, SP ;
WILKINSON, CDW ;
JOHNSON, NP ;
KEAN, AH ;
STANLEY, CR .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1990, 8 (06) :1966-1969
[3]   HYDROGEN PLASMA-ETCHING OF SEMICONDUCTORS AND THEIR OXIDES [J].
CHANG, RPH ;
CHANG, CC ;
DARACK, S .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1982, 20 (01) :45-50
[4]   REACTIVE ION ETCHING OF GAAS USING A MIXTURE OF METHANE AND HYDROGEN [J].
CHEUNG, R ;
THOMS, S ;
BEAMONT, SP ;
DOUGHTY, G ;
LAW, V ;
WILKINSON, CDW .
ELECTRONICS LETTERS, 1987, 23 (16) :857-859
[5]   VALIDITY OF SELF-BIAS VOLTAGE MEASUREMENTS ON INSULATING ELECTRODES IN RADIO-FREQUENCY DRY ETCHING SYSTEMS [J].
DEVRIES, CAM ;
VANDENHOEK, WGM .
JOURNAL OF APPLIED PHYSICS, 1985, 58 (05) :2074-2076
[6]  
HAMILTON CJ, 1995, ELECTRON LETT, V31, P393
[7]   INSITU SILICON-WAFER TEMPERATURE-MEASUREMENTS DURING RF ARGON-ION PLASMA-ETCHING VIA FLUOROPTIC THERMOMETRY [J].
HUSSLA, I ;
ENKE, K ;
GRUNWALD, H ;
LORENZ, G ;
STOLL, H .
JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1987, 20 (07) :889-896
[8]   XPS INVESTIGATION OF THE INTERACTION BETWEEN ECR-EXCITED HYDROGEN AND THE NATIVE OXIDE OF GAAS(100) [J].
MIKHAILOV, GM ;
BULKIN, PV ;
KHUDOBIN, SA ;
CHUMAKOV, AA ;
SHAPOVAL, SY .
VACUUM, 1992, 43 (03) :199-201
[9]  
Niggebrugge U., 1985, I PHYS C SER, V79, P367
[10]  
PHELPS AV, 1991, J PHYS CHEM REF DATA, V20, P567