Electron-beam-induced current study of small-angle grain boundaries in multicrystalline silicon

被引:97
作者
Chen, J
Sekiguchi, T [1 ]
Xie, R
Ahmet, P
Chikyo, T
Yang, D
Ito, S
Yin, F
机构
[1] Natl Inst Mat Sci, Nanomat Lab, Tsukuba, Ibaraki 3050044, Japan
[2] Zhejiang Univ, State Key Lab Silicon Mat, Hangzhou 310027, Peoples R China
[3] Tohoku Univ, Inst Mat Res, Sendai, Miyagi 9808577, Japan
[4] Natl Inst Mat Sci, Met Proc Grp, Tsukuba, Ibaraki 3050047, Japan
关键词
EBIC; EBSD; grain boundary defects; elemental semiconductor;
D O I
10.1016/j.scriptamat.2005.03.010
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Recombination activity of small-angle grain boundaries (SA GBs) in multicrystalline silicon (mc-Si) was studied by means of electron-beam-induced current (EBIC) technique. In the as-grown mc-Si, the EBIC contrasts of special E and random GBs were weak at both 300 and 100 K, whereas those of SA GBs were weak (< 3%) at 300 K and strong (30-40%) at 100 K. In the contaminated me-Si, SA GBs showed stronger EBIC contrast than Sigma and R GBs at 300 K. It is indicated that SA GBs possess high density of shallow levels and are easily contaminated with Fe compared to other GBs. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:1211 / 1215
页数:5
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