Wafer-bonding and thinning technologies

被引：20

作者：

Desmond-Colinge, CA ^{[1
]}

Gösele, U

机构：

[1] Calif State Univ Sacramento, Dept Elect Engn, Sacramento, CA 95819 USA

[2] Max Planck Inst Microstruct Phys, Halle, Germany

来源：

MRS BULLETIN | 1998年 / 23卷 / 12期

关键词：

D O I：

10.1557/S0883769400029808

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

[No abstract available]

引用

页码：30 / 34

页数：5

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