Electromigration failure in flip chip solder joints due to rapid dissolution of copper

被引：123

作者：

Hu, YC

Lin, YH

Kao, CR ^{[1
]}

Tu, KN

机构：

[1] Natl Cent Univ, Dept Chem & Mat Engn, Chungli, Taiwan

[2] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA

来源：

JOURNAL OF MATERIALS RESEARCH | 2003年 / 18卷 / 11期

基金：

美国国家科学基金会;

关键词：

D O I：

10.1557/JMR.2003.0355

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

An electromigration failure mechanism in flip chip solder joints is reported in this communication. The solder joints failed by a very rapid, asymmetrical, and localized dissolution of the Cu metallization on the cathode side. The average dissolution rate was about I mum/min. The dissolved Cu included not only the Cu under bump metallurgy but also the on-chip Cu conducting trace. From the location and geometry of the dissolved Cu, it can be concluded that current crowding plays a critical role in the rapid dissolution. The dissolved Cu atoms were driven to the anode side by electromigration, and a large amount of Cu6Sn5 was formed there.

引用

页码：2544 / 2548

页数：5

共 17 条

[11]

RAHN A, 1993, BASICS SOLDERING, P28

[12]

Warburton WK., 1975, DIFFUSION SOLIDS REC, P171, DOI [10.1016/B978-0-12-522660-8.50009-X, DOI 10.1016/B978-0-12-522660-8.50009-X]

[13] Electromigration failures of UBM/bump systems of flip-chip packages [J].

Wu, JD ;

Zheng, PJ ;

Lee, K ;

Chiu, CT ;

Lee, JJ .

52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, :452-457

[14] A CALCULATION OF RELAXATION MIGRATION AND FORMATION ENERGIES FOR SURFACE DEFECTS IN COPPER [J].

WYNBLATT, P ;

GJOSTEIN, NA .

SURFACE SCIENCE, 1968, 12 (02) :109-&

[15] Thermomigration in Pb-Sn solder joints under joule heating during electric current stressing [J].

Ye, H ;

Basaran, C ;

Hopkins, D .

APPLIED PHYSICS LETTERS, 2003, 82 (07) :1045-1047

[16] Current-crowding-induced electromigration failure in flip chip solder joints [J].

Yeh, ECC ;

Choi, WJ ;

Tu, KN ;

Elenius, P ;

Balkan, H .

APPLIED PHYSICS LETTERS, 2002, 80 (04) :580-582

[17] Six cases of reliability study of Pb-free solder joints in electronic packaging technology [J].

Zeng, K ;

Tu, KN .

MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2002, 38 (02) :55-105

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