Compliant effect of low-temperature Si buffer for SiGe growth

被引:37
作者
Luo, YH [1 ]
Wan, J [1 ]
Forrest, RL [1 ]
Liu, JL [1 ]
Jin, G [1 ]
Goorsky, MS [1 ]
Wang, KL [1 ]
机构
[1] Univ Calif Los Angeles, Dept Elect Engn, Device Res Lab, Los Angeles, CA 90095 USA
关键词
D O I
10.1063/1.1337633
中图分类号
O59 [应用物理学];
学科分类号
摘要
Relaxed SiGe attracted much interest due to the applications for strained Si/SiGe high electron mobility transistor, metal-oxide-semiconductor field-effect transistor, heterojunction bipolar transistor, and other devices. High-quality relaxed SiGe templates, especially those with a low threading dislocation density and smooth surface, are critical for device performance. In this work, SiGe films on low-temperature Si buffer layers were grown by solid-source molecular-beam epitaxy and characterized by atomic force microscope, double-axis x-ray diffraction, and photoluminescence spectroscopy. It was demonstrated that, with the proper growth temperature and Si buffer thickness, the low-temperature Si buffer became tensily strained and reduced the lattice mismatch between the SiGe and the Si buffer layer. This performance is similar to that of the compliant substrate: a thin substrate that shares the mismatch strain in heteroepitaxy. Due to the smaller mismatch, misfit dislocation and threading dislocation densities were lower. (C) 2001 American Institute of Physics.
引用
收藏
页码:454 / 456
页数:3
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