An ATM-based intelligent optical backplane using CMOS-SEED smart pixel arrays and free-space optical interconnect modules

被引：12

作者：

Goodwill, DJ

Devenport, KE

Hinton, HS

机构：

[1] University of Colorado, Dept. of Elec. and Comp. Engineering, Boulder

[2] University of Colorado, Boulder, CO

[3] University of Missouri, Columbia, MO

[4] Bell Labs. of Lucent Technologies, Holmdel, NJ

来源：

IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS | 1996年 / 2卷 / 01期

基金：

美国国家科学基金会;

关键词：

D O I：

10.1109/2944.541877

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The architecture, smart pixel array chip design, and optical design of an intelligent free-space digital optical backplane for ATM switching are presented. The smart pixel chip uses reflective SEED (self-electrooptic effect device) optical modulators and detectors flip-chip bonded to CMOS circuitry, This chip is one of the most complex designs ever reported in this technology, and it operates at a simulated backplane clock rate of 125 MHz. The low-loss optical system employs f/4 diffractive minilenses and microlenses to interconnect clusters of smart pixels, and it is shown to allow 2060 connections per chip if 1-cm(2)-sized smart pixel chips are used. This gives a predicted bisection bandwidth of around 1 Tb/s across a 10-in circuit board edge for a full-sized system.

引用

页码：85 / 96

页数：12

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