A study of bimodal distributions of time-to-failure of copper via electromigration

被引：10

作者：

Lai, JB ^{[1
]}

Yang, JL ^{[1
]}

Wang, YP ^{[1
]}

Chang, SH ^{[1
]}

Hwang, RL ^{[1
]}

Huang, YS ^{[1
]}

Hou, CS ^{[1
]}

机构：

[1] Taiwan Semicond Mfg Co, Hsinchu, Taiwan

来源：

2001 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS, AND APPLICATIONS, PROCEEDINGS OF TECHNICAL PAPERS | 2001年

关键词：

D O I：

10.1109/VTSA.2001.934537

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Bimodal distributions of time-to-failure (TTF) were often seen in copper via electromigration (EM) tests. The failure mechanism of the stressed samples could be correlated to time-to-failure of EM test. Early-failures were via-related, whereas late-failures were metal-stripe-related. The failure mechanisms will be discussed.

引用

页码：271 / 274

页数：4

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