A novel multilayer circuit process using YBa2Cu3Ox/SrTiO3 thin films patterned by wet etching and ion milling

被引:8
作者
Li, HQ [1 ]
Ono, RH [1 ]
Vale, LR [1 ]
Rudman, DA [1 ]
Liou, SH [1 ]
机构
[1] UNIV NEBRASKA,DEPT PHYS,LINCOLN,NE 68588
关键词
D O I
10.1063/1.117700
中图分类号
O59 [应用物理学];
学科分类号
摘要
A process combining hydrofluoric acid (HF) and Ar+ ion milling has been used to make YBa2Cu3Ox/SrTiO3/YBa2Cu3Ox(YBCO/STO/YBCO multilayer test circuits. Low-angle steps can be readily etched in STO and YBCO films with this process. YBCO lines crossing 5 degrees steps have about the same critical temperature T-c (89-99 K) and critical current density J(c) (>1x10(6) A/cm(2) at 86 K) as lines on planar surfaces. Via connections have the same T-c as other circuit components and adequate critical currents for most circuit designs. (C) 1996 American Institute of Physics.
引用
收藏
页码:2752 / 2754
页数:3
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