Investigation Into IGBT dV/dt During Turn-Off and Its Temperature Dependence

被引:181
作者
Bryant, Angus [1 ]
Yang, Shaoyong [1 ]
Mawby, Philip [1 ]
Xiang, Dawei [2 ]
Ran, Li [2 ]
Tavner, Peter [2 ]
Palmer, Patrick R. [3 ]
机构
[1] Univ Warwick, Sch Engn, Coventry CV4 7AL, W Midlands, England
[2] Univ Durham, Sch Engn, Durham DH1 3LE, England
[3] Univ Cambridge, Dept Engn, Ctr Adv Photon & Elect, Cambridge CB3 0FA, England
基金
英国工程与自然科学研究理事会;
关键词
Converter; dynamic avalanche; power electronics; power semiconductor device; reliability; GATE BIPOLAR-TRANSISTOR; TRANSIENT JUNCTION TEMPERATURE; POWER; MODELS; LIFETIME; OPTIMIZATION; RELIABILITY; RECTIFIERS; OPERATION; DEVICES;
D O I
10.1109/TPEL.2011.2125803
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In many power converter applications, particularly those with high variable loads, such as traction and wind power, condition monitoring of the power semiconductor devices in the converter is considered desirable. Monitoring the device junction temperature in such converters is an essential part of this process. In this paper, a method for measuring the insulated gate bipolar transistor (IGBT) junction temperature using the collector voltage dV/dt at turn-OFF is outlined. A theoretical closed-form expression for the dV/dt at turn-OFF is derived, closely agreeing with experimental measurements. The role of dV/dt in dynamic avalanche in high-voltage IGBTs is also discussed. Finally, the implications of the temperature dependence of the dV/dt are discussed, including implementation of such a temperature measurement technique.
引用
收藏
页码:3019 / 3031
页数:13
相关论文
共 50 条
[1]   Transient temperature measurements and modeling of IGBT's under short circuit [J].
Ammous, A ;
Allard, B ;
Morel, H .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 1998, 13 (01) :12-25
[2]  
ATLAS, 2011, SILV TCAD SOFTW
[3]   Measurement of the transient junction temperature in MOSFET devices under operating conditions [J].
Barlini, D. ;
Ciappa, M. ;
Mermet-Guyennet, M. ;
Fichtner, W. .
MICROELECTRONICS RELIABILITY, 2007, 47 (9-11) :1707-1712
[4]   New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions [J].
Barlini, D. ;
Ciappa, M. ;
Castellazzi, A. ;
Mermet-Guyennet, M. ;
Fichtner, W. .
MICROELECTRONICS RELIABILITY, 2006, 46 (9-11) :1772-1777
[5]   Doubly-fed-machines in wind-turbine systems: Is this application limiting the lifetime of IGBT-frequency-converters? [J].
Bartram, M ;
von Bloh, J ;
De Doncker, RW .
PESC 04: 2004 IEEE 35TH ANNUAL POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1-6, CONFERENCE PROCEEDINGS, 2004, :2583-2587
[6]   Exploration of power device reliability using compact device models and fast electrothermal simulation [J].
Bryant, Angus T. ;
Mawby, Philip A. ;
Palmer, Patrick R. ;
Santi, Enrico ;
Hudgins, Jerry L. .
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2008, 44 (03) :894-903
[7]   Numerical optimization of an active voltage controller for high-power IGBT converters [J].
Bryant, Angus T. ;
Wang, Yalan ;
Finney, Stephen J. ;
Lim, Tee Chong ;
Palmer, Patrick R. .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2007, 22 (02) :374-383
[8]   Two-step parameter extraction procedure with formal optimization for physics-based circuit simulator IGBT and PIN diode models [J].
Bryant, AT ;
Kang, XS ;
Santi, E ;
Palmer, PR ;
Hudgins, JL .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2006, 21 (02) :295-309
[9]  
Calmon F., 1995, EPE '95. 6th European Conference on Power Electronics and Applications, P234
[10]  
Chen H., 2006, 3rd IET International Conference on Power Electronics, Machines and Drives (PEMD 2006), P440, DOI 10.1049/cp:20060147