Development of all metal electro-thermal actuator and its applications

被引:13
作者
Luo, JK [1 ]
He, JH [1 ]
Flewitt, AJ [1 ]
Moore, DF [1 ]
Spearing, SM [1 ]
Fleck, NA [1 ]
Milne, WI [1 ]
机构
[1] Univ Cambridge, Dept Engn, Cambridge CB2 1PZ, England
来源
MEMS/MOEMS COMPONENTS AND THEIR APPLICATIONS | 2004年 / 5344卷
关键词
finite element analysis; metal thermal actuator; electroplating; Ni; heatuator; microswitch;
D O I
10.1117/12.524098
中图分类号
O42 [声学];
学科分类号
070206 ; 082403 ;
摘要
The in-plane motion of microelectrothermal actuator ("heatuator") has been analysed for Si-based and metallic devices. It was found that the lateral deflection of a heatuator made of a Ni-metal is about similar to60% larger than that of a Si-based actuator under the same power consumption. Metals are much better for thermal actuators as they provide a relatively large deflection and large force, for a low operating temperature, and power consumption. Electroplated Ni films were used to fabricate heatuators. The electrical and mechanical properties of electroplated Ni thin films have been investigated as a function of temperature and plating current density, and the process conditions have been optimised to obtain stress-free films suitable for MEMS applications. Lateral thermal actuators have been successfully fabricated, and electrically tested. Microswitches and microtweezers utilising the heatuator have also been fabricated and tested.
引用
收藏
页码:201 / 210
页数:10
相关论文
共 31 条
[1]  
AESAR A, 2003, RES CHEM METALS MAT, P945
[2]  
ASHBY MF, 1999, MAT MECH DESIGN
[3]  
BOYLE P, 2002, IEEE EL COMP TECHN C
[4]   Investigations of effects of bias polarization and chemical parameters on morphology and filling capability of 130 nm damascene electroplated copper [J].
Chang, SC ;
Shieh, JM ;
Lin, KC ;
Dai, BT ;
Wang, TC ;
Chen, CF ;
Feng, MS ;
Li, YH ;
Lu, CP .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2001, 19 (03) :767-773
[5]   Vertical thermal actuators for micro-opto-electro-mechanical systems [J].
Cowan, WD ;
Bright, VM .
MICROELECTRONIC STRUCTURES AND MEMS FOR OPTICAL PROCESSING III, 1997, 3226 :137-146
[6]  
GARDNER JW, 1994, MICROSENSORS PRINCIP
[7]  
Gobet J., 1993, Journal of Micromechanics and Microengineering, V3, P123, DOI 10.1088/0960-1317/3/3/007
[8]   Heat transfer analysis and optimization of two-beam microelectromechanical thermal actuators [J].
Hickey, R ;
Kujath, M ;
Hubbard, T .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 2002, 20 (03) :971-974
[9]  
HIRANO T, 1993, TRANSDUCERS, V93, P80
[10]   Analysis and design of polysilicon thermal flexure actuator [J].
Huang, QA ;
Lees, NKS .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1999, 9 (01) :64-70