Growth and morphology of the intermetallic compounds formed at the Sn-9Zn-2.5Ag/Cu interface

被引：16

作者：

Chang, TC

Wang, MC

Hon, MH

机构：

[1] Natl Kaohsiung Univ Appl Sci, Dept Mech Engn, Kaohsiung 80782, Taiwan

[2] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan

[3] Natl United Univ, Dept Mat Sci & Engn, Miaoli 360, Taiwan

[4] Dayeh Univ, Changhua 515, Taiwan

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2005年 / 402卷 / 1-2期

关键词：

interdiffusion coefficient; solder joint; intermetallic compound;

D O I：

10.1016/j.jallcom.2005.04.141

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 [物理化学]; 081704 [应用化学];

摘要：

The growth and morphology of the intermetallic compounds formed at the solder joint between the Sn-9Zn-2.5Ag lead-free solder and the Cu substrate have been investigated in this study. The planar CU6Sn5 formed after soldering transforms to a scalloped Cu5Znx after aging at 180 degrees C for 250h. However, the Cu5Zn8 decomposes and the scalloped Cu6Sn5 reforms at the interface close to the solder alloy after aging for 400h. The eta'-Cu6Sn5 transforms to the eta-Cu6Sn5 as aged at 180 degrees C. The interdiffusion coefficient of Cu and Sn in the Cu6Sn5 is determined as 2.58 x 10(-13) cm(2) s(-1), and that of Cu and Zn in the Cu5Zn8 layers is determined as 3.36 x 10(-14) cm(2) s(-1) at 180 degrees C, from the estimated thickness of the intermetallic compound (IMC). On the other hand, they are determined as 3.43 x 10(-13) and 2.36 x 10(-14) cm(2) s(-1), respectively, from the microbeam EDS analysis. (c) 2005 Elsevier B.V. All rights reserved.

引用

页码：141 / 148

页数：8

共 33 条

[1]

Morphology and adhesion strength of the Sn-9Zn-3.5Ag/Cu interface after aging [J].