2-stack 1D-1R cross-point structure with oxide diodes as switch elements for high density resistance RAM applications

被引:239
作者
Lee, Myoung-Jae [1 ]
Park, Youngsoo [1 ]
Kang, Bo-Soo [1 ]
Ahn, Seung-Eon [1 ]
Lee, Changbum [1 ]
Kim, Kihwan [1 ]
Xianyu, Wenxu [1 ]
Stefanovich, G. [1 ]
Lee, Jung-Hyun
Chung, Seok-Jae [2 ]
Kim, Yeon-Hee [2 ]
Lee, Chang-Soo [2 ]
Park, Jong-Bong [3 ,4 ]
Baek, In-Gyu
Yoo, In-Kyeong [1 ]
机构
[1] Samsung Adv Inst Technol, Semicond Device Lab, San 14-1, Yongin 446712, Gyeonggi Do, South Korea
[2] Samsung Adv Inst Technol, Nano Fabricat Technol Ctr, Yongin 446712, Gyeonggi Do, South Korea
[3] Samsung Adv Inst Technol, Anal Engn Ctr, Yongin 446712, Gyeonggi Do, South Korea
[4] Samsung Elect Co Ltd, Semicond R&D Ctr, Adv Proc Dev Team, Yongin 446712, Gyeonggi Do, South Korea
来源
2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2 | 2007年
关键词
D O I
10.1109/IEDM.2007.4419061
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We have successfully integrated a 2-stack 8x8 array 1D-1R(one diode-one resistor) structure with 0.5umx0.5um cells in order to demonstrate the feasibility of high density stacked RRAM. p-CuOx/n-InZnOx heterojunction thin film was used for the first time as a oxide diode which shows increased current density of two orders over our previous p-NiOx/n-TiOx oxide diode. And Ti-doped NiO was used for the storage node. No limitation to the number of stacks has been observed from our results. Cell and device properties of our cross-point structure 8x8 array are reported. In addition, all fabrication processes were done at room temperature without other dedicated facilities or processes allowing for compatibility with current CMOS technology. Bi-stable switching for 1D-1R memory was demonstrated for our 2-stack cross-point structures showing excellent behavior for both diode and storage nodes. The forward current density for p-CuOx/n-IZO(x) diodes was over 10(4)A/cm(2), and the operation voltage for the storage node with diode attached was around 3V.
引用
收藏
页码:771 / +
页数:3
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