High-performance sub-0.08 μm CMOS with dual gate oxide and 9.7 ps inverter delay

被引:43
作者
Hargrove, M [1 ]
Crowder, S [1 ]
Nowak, E [1 ]
Logan, R [1 ]
Han, LK [1 ]
Ng, H [1 ]
Ray, A [1 ]
Sinitsky, D [1 ]
Smeys, P [1 ]
Guarin, F [1 ]
Oberschmidt, J [1 ]
Crabbé, E [1 ]
Yee, D [1 ]
Su, L [1 ]
机构
[1] IBM Corp, Semicond Res & Dev Ctr, Hopewell Junction, NY 12533 USA
来源
INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST | 1998年
关键词
D O I
10.1109/IEDM.1998.746436
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We report a high-performance CMOS operating at 1.5V with 11.9 ps nominal inverter delay at 0.06/0.08 mu m L-eff for NMOS and PMOS. Both NMOS and PMOS devices, with 3.6 nm inversion T-ox, have the best current drive reported to date at fixed I-off. Low-Vt NMOS/PMOS achieved with compensation and with no degradation in short-channel behavior result in nominal 9.7ps inverter delay. These devices are incorporated in a 0.18 mu m technology that offers a 4.2 mu m(2) SRAM cell and dual gate oxide for interfacing to 2.5V.
引用
收藏
页码:627 / 630
页数:4
相关论文
共 4 条
[1]   SIMULTANEOUS GROWTH OF DIFFERENT THICKNESS GATE OXIDES IN SILICON CMOS PROCESSING [J].
DOYLE, B ;
SOLEIMANI, HR ;
PHILIPOSSIAN, A .
IEEE ELECTRON DEVICE LETTERS, 1995, 16 (07) :301-302
[2]   Electrical characteristics and reliability of sub-3 nm gate oxides grown on nitrogen implanted silicon substrates [J].
Han, LK ;
Crowder, S ;
Hargrove, M ;
Wu, E ;
Lo, SH ;
Guarin, F ;
Crabbe, E ;
Su, L .
INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST, 1997, :643-646
[3]   A 0.10μm gate length CMOS technology with 30Å gate dielectric for 1.0V-1.5V applications [J].
Rodder, M ;
Hanratty, M ;
Rogers, D ;
Laaksonen, T ;
Hu, JC ;
Murtaza, S ;
Chao, CP ;
Hattangady, S ;
Aur, S ;
Amerasekera, A ;
Chen, IC .
INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST, 1997, :223-226
[4]  
YANG LY, 1998, VLSI, P148