Time-dependent exposure dose of hydrogen silsesquioxane when used as a negative electron-beam resist

被引:20
作者
Clark, Nathaniel [1 ]
Vanderslice, Amy [1 ]
Grove, Robert, III [1 ]
Krchnavek, Robert R. [1 ]
机构
[1] Rowan Coll, Glassboro, NJ 08028 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2006年 / 24卷 / 06期
基金
美国国家科学基金会;
关键词
D O I
10.1116/1.2366697
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Hydrogen silsesquioxane (HSQ) is used as a high-resolution, negative-tone, inorganic electron-beam resist for use in nanoimprint lithography. Previous studies show that I week long exposure delay in air decreases sensitivity and enhances the contrast of HSQ [F. C. M. J. M. van Delft, J. Vac. Sci. Technol. B 20, 2932 (2002)]. In this work, the authors report that the electron-beam dose required for high-resolution (sub-50-nm) HSQ patterning is shown to be very sensitive to the time the sample has been at room temperature. For example, a sample written with nanoscale features at constant e-beam dose will increase in size approximately 66% per hour of time at room temperature. The minimum feature size for a given dose depends on the ambient conditions the sample was stored in (air, nitrogen, vacuum). Samples stored in vacuum are not exempt from the feature broadening. Long e-beam writing times for large-area patterning of nanoscale features will likely suffer from this time dependence unless the exposure dose is varied during the e-beam writing. The experiments relating the various ambient conditions and the minimum feature size under dose control are presented. (c) 2006 American Vacuum Society.
引用
收藏
页码:3073 / 3076
页数:4
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