Optical lithography with printed metal mask and a simple superhydrophobic surface

The use of optical lithography to produce a structured superhydrophobic surface onto a photoresist, is analyzed. A metal pattern was used for printed onto a photoresist as a photomask for the patterning of the resist. The patterning techniques involve embossed photoresists and elastomeric phase masks. Fluorinated ethylene propylene (FEP) copolymer was used in the process, which lowered the work needed for adhesion at the FEP-metal interface for easy release of the metal from the mold in the transfer printing. The scanning electron microscopy (SEM) images of the patterning were acquired by the lithography with transfer printed metal mask. FEP was deposited by thermal evaporation to a thickness of 15 nm followed by deposition of 70-nm thick aluminum. The UV-curable mold was also used in the process with the thickness ranging from 0.3 to 1 mm.