Contribution to carrier densities of the oxygen vacancy in a low-resistivity tin-doped indium oxide film by the hot-cathode plasma sputtering method

被引:7
作者
Kono, Akihiko [1 ,2 ]
Nagai, Tatsuzo [3 ]
Shoji, Fumiya [1 ]
机构
[1] Kyushu Kyoritsu Univ, Fac Engn, Kitakyushu, Fukuoka 8078585, Japan
[2] Kanazawa Inst Technol, Res Lab Integrated Technol Syst, Haku San 9240838, Japan
[3] Kyushu Kyoritsu Univ, Res Ctr, Kitakyushu, Fukuoka 8078585, Japan
关键词
Thin film; Indium tin Oxide (ITO) film; Transparent conducting oxide (TCO) film; Sputtering; ELECTRICAL-PROPERTIES; THIN-FILMS;
D O I
10.1016/j.matlet.2009.12.022
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In order to clarify the contribution to carrier density by oxygen vacancies in tin-doped indium oxide (ITO) films prepared on glass substrates by the hot-cathode plasma sputtering method, we have investigated the effect of annealing on the electrical properties of an ITO film with a resistivity of 1.0 x 10(-4) Omega cm. A drastic decrease in carrier density from 2.0 x 10(21) to 0.88 x 10(21) cm(-3) was found with gradual increase in the Hall mobility from 29 to 35 cm(2) V-1 s(-1) for repeated annealing cycles, when the ITO film was exposed for one hour to 400 degrees C oxygen gas at atmospheric pressure. The results indicate that the contribution of oxygen vacancies to carrier density was ca. 1.12 x 10(21) cm(-3) for the ITO film with an overall carrier density of 2.0 x 10(21) cm(-3). (C) 2009 Elsevier B.V. All rights reserved.
引用
收藏
页码:622 / 624
页数:3
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