The past, present, and future of silicon photonics

被引:1636
作者
Soref, Richard [1 ]
机构
[1] USAF, Res Lab, Sensors Directorate, Hanscom AFB, MA 01731 USA
关键词
CMOS; electroabsorption; Ge photodetectors; GeSn; optoelectronic integrated circuits; photonic crystals (PhCs); photonic integrated circuits (PICs); plasmonics; SiGeSn; silicon lasers;
D O I
10.1109/JSTQE.2006.883151
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The pace of the development of silicon photonics has quickened since 2004 due to investment by industry and government. Commercial state-of-the-art CMOS silicon-on-insulator (SOI) foundries are now being utilized in a crucial test of 1.55-mu m monolithic optoelectronic (OE) integration, a test sponsored by the Defense Advanced Research Projects Agency (DARPA). The preliminary results indicate that the silicon photonics are truly CMOS compatible. R&D groups have now developed 10-100-Gb/s electro-optic modulators, ultrafast Ge-on-Si photodetectors, efficient fiber-to-waveguide couplers, and Si Raman lasers. Electrically pumped silicon lasers are under intense investigation, with several approaches being tried; however, lasing has not yet been attained. The new paradigm for the Si-based photonic and optoelectric integrated circuits is that these chip-scale networks, when suitably designed, will operate at a wavelength anywhere within the broad spectral range of 1.2-100 mu m, with cryocooling needed in some cases.
引用
收藏
页码:1678 / 1687
页数:10
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