Dynamics of thermal growth of silicon oxide films on Si

被引:43
作者
de Almeida, RMC
Gonçalves, S
Baumvol, IJR
Stedile, FC
机构
[1] Univ Fed Rio Grande do Sul, Inst Fis, BR-91501970 Porto Alegre, RS, Brazil
[2] Univ Fed Rio Grande do Sul, Inst Quim, BR-91501970 Porto Alegre, RS, Brazil
关键词
D O I
10.1103/PhysRevB.61.12992
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Thermal growth of silicon oxide films on Si in dry O-2 is modeled as a dynamical system, assuming that it is basically a reaction-diffusion phenomenon. Relevant findings of the last decade are incorporated, as structure and composition of the oxide/Si interface and O-2 transport and reaction at initial stages of growth. The present model departs from the well-established Deal and Grove framework [B. E. Deal and A. S. Grove, J. Appl. Phys. 36, 3770 (1965)] indicating that its basic assumptions, steady-state regime, and reaction between O-2 and Si at a sharp oxide/Si interface are only attained asymptotically. Scaling properties of these model equations are explored, and experimental growth kinetics, obtained for a wide range of growth parameters including the small thickness range, are shown to be well described by the model.
引用
收藏
页码:12992 / 12999
页数:8
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